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LCD DISPLAY

Multi-device compatibility, ultra-thin design.

 

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OLED DISPLAY

Self-generated light, extreme contrast, color realism.

 

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TFT-LCD

High-definition resolution, wide viewing angle design, low power consumption, long life.

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EPD

Paper-like display, eye protection and comfort; thin, flexible, portable and durable.

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Who We Are

We are a high-tech company specializing in the development and sales of electronic accessories and liquid crystal display devices.

Core businesses:
    - Develops and manufactures high performance electronics components, including power adapters, connectors, circuit boards, etc.
    - Focus on TFT, IPS, OLED and other LCD display technology research and development, products range from small to large display screen solutions.
    - Provides high-resolution, low-power, wide-angle display products.
    - We have a comprehensive global supply chain and sales network to provide efficient and reliable import and export trade services to our customers.

    We are committed to providing our customers with innovative technology solutions and high quality products”.

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Most Popular Blog Posts

TFT-LCD: The Core of Modern Display Technology

TFT-LCD(Thin Film Transistor Liquid Crystal Display)is one of the most common display technologies in modern electronic devices. It achieves precise control of each pixel by integrating a thin-film transistor under each pixel point, thus providing high-quality image display.

At the heart of TFT-LCD are liquid crystal materials, which change the arrangement of their molecules under the action of an electric field, thereby controlling the passage of light. The TFT (thin film transistor) acts as a switch to control the voltage of each pixel, which in turn adjusts the arrangement of the liquid crystal molecules, and finally forms the image.

High resolution: The TFT-LCD enables high pixel density, ...

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Exploring Cog Packaging Technology: A New Era in Chip Packaging

COG packaging technology is an advanced packaging method that binds chips directly to glass substrates. This technology achieves higher integration and better electrical performance by installing the driver IC (integrated circuit) directly on the glass substrate of the LCD or OLED display panel.

The core of COG packaging technology is the use of anisotropic conductive adhesive (ACF) to connect the pins of the chip to the electrodes on the glass substrate. Under heating and pressurizing conditions, the conductive particles form vertical conductive channels, thereby achieving electrical connections while maintaining horizontal insulation.

High integration: The chip is directly installed on the glass substrate,...

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