Exploring Cog Packaging Technology: A New Era in Chip Packaging

What is Cog Packaging Technology?
COG packaging technology is an advanced packaging method that binds chips directly to glass substrates. This technology achieves higher integration and better electrical performance by installing the driver IC (integrated circuit) directly on the glass substrate of the LCD or OLED display panel.
Working Principle of COG Packaging Technology
The core of COG packaging technology is the use of anisotropic conductive adhesive (ACF) to connect the pins of the chip to the electrodes on the glass substrate. Under heating and pressurizing conditions, the conductive particles form vertical conductive channels, thereby achieving electrical connections while maintaining horizontal insulation.

Advantages of COG packaging technology
High integration: The chip is directly installed on the glass substrate, reducing the lead frame and substrate in traditional packaging, and improving the integration.
Lightweight design: Due to the reduction of intermediate connection materials, the Cog package can achieve a more lightweight design.
Excellent electrical performance: shortened signal transmission path, reduced signal delay and loss, and improved electrical performance.
Cost-effectiveness: The packaging process has been simplified, reducing material costs and production costs.
Application of COG Packaging Technology
Cog packaging technology is widely used in various display devices, including:
Smart phone: Driver IC package for high-resolution display screen.
Tablets: Offer a thinner, lighter display solution.
TV: In the large size display screen to achieve high integration and excellent performance.
Wearable devices: Suitable for smartwatches and AR/VR devices that require lightweight designs.